High-Speed Connectivity Engineering & Custom IP for the AI Era | SNOVA

High-Speed Connectivity Engineering & Custom IP for the AI Era

Semiconductor engineering for the high-speed interfaces and protocols modern AI infrastructure depends on.

See the Connectivity Stack →
PCIe — host I/O
SCALE-OUT
Ethernet / UEC — rack-to-rack and cluster networking
SNOVA: IP ·
design · verification
SCALE-UP
UALink — accelerator-to-accelerator fabric within a pod
SNOVA: IP ·
design · verification
DIE-TO-DIE
UCIe / Custom Chip-to-Chip & Die-to-Die — chiplet interconnect inside the package
SNOVA: IP ·
design · verification
Compute: RISC-V · Edge AI

Who We Work With

From AI hardware startups to hyperscale infrastructure teams, we integrate with semiconductor engineering organizations at critical interconnect milestones.

AI Accelerator Builders

Scaling memory-semantic fabric bandwidth with custom UALink and PCIe Gen6 controller integration.

Hyperscale Infrastructure

Ethernet & UEC cluster fabrics reaching 800G and 1.6T per port with zero-loss telemetry.

Chiplet SoC Teams

UCIe and Custom Chip-to-Chip & Die-to-Die PHY integration, D2D adapters, and multi-die verification.

Edge AI & Compute

Custom RISC-V compute cores, vector datapath extensions, and hardware-aware inference acceleration.

Why Connectivity Decides AI Performance

Compute capacity is no longer the sole gating factor in AI clusters. As model parameters grow, communication overhead between accelerators, packages, and racks dominates end-to-end training and inference efficiency. SNOVA delivers the protocol-depth engineering that keeps compute fed at silicon speed.

Domains & Expertise

Domains

Networking
Ethernet & UEC · UALink · PCIe · UCIe · Custom Chip-to-Chip & Die-to-Die
Compute
RISC-V · Edge AI

Skills & Expertise

  • Digital Design — RTL design, micro-architecture and optimization
  • Custom IP Development — custom IP architecture, RTL and IP hardening
  • Integration & Verification — SystemVerilog, UVM, VIP and compliance testing
  • Prototyping — hardware validation, bring-up and real-traffic testing
Silicon-Proven Rigor
1B+ Parts Sold · 20 Chips in Production · 100+ Man-Years of Experience

Where we work.

Layer Technology Primary Problem Typical Silicon SNOVA Role
Scale-out
Ethernet & UEC Bandwidth, latency, reliability at scale NICs, Switches Design Verification
Scale-up
UALink · UEC · ESUN · SUE-T Efficient accelerator-to-accelerator links AI Accelerators, Switch ASICs Verification & Integration
Die-to-die
UCIe · Custom Chip-to-Chip & Die-to-Die High-density chiplet connectivity Chiplets, Advanced SoCs PHY Integration · Custom Chip-to-Chip & Die-to-Die verification
Host I/O
PCIe (PCI-SIG) High-performance host connectivity CPUs, SoCs, Controllers IP, firmware, validation
Compute
RISC-V Open, scalable compute architecture CPUs, SoCs, Accelerators SoC integration, enablement
Embedded
Edge AI Real-time inference at the edge Edge Devices, NPUs Optimization, integration
We design and verify against IEEE 802.3, UEC, UALink, UCIe, PCIe and RISC-V specifications.

Four ways
we deliver.

Explore Services →

Digital Design

Clean RTL, CDC, lint, and implementation excellence.

Custom IP Development

Custom IP architecture, RTL and IP hardening built to your requirements.

Integration & Verification

SystemVerilog, UVM, VIP, coverage closure and compliance testing.

Prototyping

FPGA-based hardware validation, bring-up and real-traffic testing.

Three ways to engage

01 — Project-Based

Project-Based

A defined deliverable, fixed scope, milestones and acceptance criteria. SNOVA owns delivery from requirements to completion.

Best for: a specific engineering gap with a hard deadline.
02 — Dedicated Engineering Team

Dedicated Engineering Team

Named engineers embedded in your workflow, tools and standups. Sustained engineering capacity to support your roadmap without adding permanent headcount.

Best for: roadmap capacity that needs to scale.
03 — Custom IP Development

Custom IP Development

IP architected and built around your specifications, with development, verification and integration support. Purpose-built for your silicon and application requirements.

Best for: a custom block built to your specifications.

Engineering-first thinking on the AI interconnect.

Read Insights →
Scale-Up vs Scale-Out

Scale-Up vs Scale-Out

When to use which fabric, and how they work together to unlock performance.

Read Article →
The Road to 1.6T Ethernet

The Road to 1.6T Ethernet

What’s driving next-gen Ethernet and the IP challenges behind it.

Read Article →
UCIe in Practice

UCIe in Practice

Design trade-offs, verification strategies, and real-world chiplet deployments.

Read Article →

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